科技研發
集產品設計、研發、製造
以高效、優質且專業全方位服務客戶
| 核心技術 |
| 產品應用 |
01/
核心技術
02/
產品應用
Test Report (By Case)Wire Dia.: SF1 0.9mil (23um) Wire Bond : ASM XTREME Without N2 /N2H2 Gas |
This kind of the wire loop is the most commonly used.
It’s debugging is simple and convenient,
high production efficiency,
but also the highest rate to fail after TS test.
Spec.:
1. Can not forward and backward.
2. Loop Length : over 30um
3. Loop High : 130-160um
4. Wire Pull : >10g
5. TST :-40℃~100 ℃ / 500 cycs
Test Report (By Case)Wire Dia.: SF1 1.0mil (25um) Wire Bond : KNS Iconn Without N2 /N2H2 Gas |
Spec.:
1. Can not forward and backward.
2. Loop Length : over 45um
3. Loop High : 100-160um
4. Wire Pull : >10g
5. TST :-45℃~125 ℃ / 1000 cycs
This loop need to more control the parameters,
and more complete than normal loop.
Because of these more kinks,
the production efficiency is the slowest.
Test Report (By Case)Wire Dia.: SH1 0.8mil (20um) Wire Bond : ASM 380 Without N2 /N2H2 Gas
|
Spec.:
1. Need to have a forward shape.
2. Loop Length : over 25um
3. Loop High : 130-170um
4. Wire Pull : >8g
5. TST :-40℃~100 ℃ / 600 cycs
Reliability is a better improvement.
Production efficiency is 5% slower than the normal loop.
Test Report (By Case)Wire Dia.: SH1 0.8mil (20um) Wire Bond : ASM 380 Without N2 /N2H2 Gas
|
Spec.:
1. Can not forward and backward.
2. Loop High : 130-170um
3. Loop Angle : 40°
4. Wire Pull : >8g
5. TST :-40℃~100 ℃ / 300 cycs
